512GB Samsung 960 PRO M.2 NVMe SSD
5 In StockNew5 Year
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General Brand Samsung Series 950 Pro Model MZ-V5P512BW Highlights Samsung 950 Pro Series MZ-V5P512BW Internal Solid State Drive (SSD), M.2 (2280) Form Factor, 512GB Capacity, Up to 2,500 MB/s (Seq. Read), Up to 1,500 MB/s (Seq. Write), PCIe 3.0 x4 (up to 32 GB/s), NVMe 1.1 Interface, Samsung UBX Controller, Samsung V-NAND Storage Memory, Samsung 512 MB Low Power DDR3 SDRAM Cache Memory, 1.5 Million Hours Reliability (MTBF). Specifications Application Client PCs Capacity 512 GB (1 GB=1 Billionbyte by IDEMA) Form Factor M.2 2280 Interface PCIe 3.0 x4 (up to 32 GB/s) NVMe 1.1 Dimension Max. 80.15 x 22.15 x 2.38 (mm) (W x H x D) Weight Max. 10g Storage Memory Samsung V-NAND Controller Samsung UBX Controller Cache Memory Samsung 512 MB Low Power DDR3 SDRAM Software Magician Software for SSD management Installation Kit Not Available Warranty 5 Year Limited Warranty or 400 TBW Limited Warranty Special Feature TRIM Support TRIM Supported S.M.A.R.T Support S.M.A.R.T Supported GC (Garbage Collection) Auto Garbage Collection Algorithm Encryption Support AES 256-bit for User Data Encryption
TCG Opal Family Spec and eDrive(IEEE1667) to be supported by FW update
WWN Support N/A Device Sleep Mode Support Yes Performance Sequential Read Up to 2,500 MB/sec Sequential Write Up to 1,500 MB/sec Random Read (4KB, QD32) Up to 300,000 IOPS Random Write (4KB, QD32) Up to 110,000 IOPS Random Read (4KB, QD1) Up to 12,000 IOPS Random Write (4KB, QD1) Up to 43,000 IOPS Environment Average Power Consumption (system level) Average: 5.7 Watts
Maximum: 7.0 Watts (Burst mode)
Power consumption (Idle) Max. 1.7 Watts TRIM Support 1.5 Million Hours Reliability (MTBF) Operating Temperature 0 °C to 70 °C (Measured by SMART Temperature. Proper airflow recommended) Shock 1500G , duration 0.5m sec, 3 axis
What is V-NAND technology?
Shedding light on a whole new standard of capacity and performance.
Samsung V-NAND technology overcomes the capacity limitations of traditional 2D NAND technology with its revolutionary vertical design.
V-NAND also applies innovative Charge Trap Flash (CTF) technology which prevents data corruption caused by cell-to-cell interference.
The synergy of both structural and material innovations leads to improved speed, power efficiency, and endurance.
Vertical expansion breaks through horizontal limit
Samsung revolutionized the storage industry by shifting the planar NAND to a vertical structure. Samsung V-NAND technology features a unique design that stacks 48 layers on top of one another instead of trying to decrease the cells’ pitch size. Samsung used Channel Hole Technology (CHT) to enable cells to connect vertically with one another through a cylindrical channel that runs through stacked cells.
Material innovation that no one can match
Samsung has shifted the paradigm of material used for NAND. Samsung applies the innovative CTF technology which uses a non-conductive layer of Silicon Nitride (SiN), temporarily trapping electrical charges to maintain cell integrity.
This non-conductive layer wraps around the control gate of the cell, acting as an insulator that holds charges to prevent data corruption caused by cell-to-cell interference.
Vertical architecture paves the way for amplified capacity
Layering cells vertically in three-dimensional stacks provides much greater cell density. Samsung V-NAND technology lets heavy-workload users and data centers store and handle more data with greatly improved capacity.
Samsung V-NAND enables up to 100 layers of cells to be stacked with the potential to scale the density up to 1 Terabit. The 2D planar NAND density ceiling can only reach the minimum density of V-NAND.
Innovative algorithms equal faster performance
Traditional planar NAND memory requires the creation of sets of complex program algorithms to prevent data corruption caused by cell-to-cell interference. However, Samsung V-NAND is virtually immune to cell-to-cell interference.
V-NAND does not need to go through a complex program algorithm to write data, and this enables the memory to write data up to two times faster than traditional 2D planar NAND flash memory.
Unprecedented power efficiency
Since V-NAND technology has eliminated the issue of cell-to-cell interference, its programming steps are greatly reduced. As a result, power consumption is substantially lowered by up to 45 percent compared to planar NAND memory.
Embedded high endurance to store your valuable data
Samsung V-NAND provides up to twice the endurance of planar NAND. V-NAND decreases its electric field because its cells are slightly larger, and employs CTF-based insulators eliminating the risk of cell-to-cell interference, resulting in superior retention performance.
In comparison between 3-bit and 2-bit, Samsung 3-bit V-NAND shows endurance similar to that of 2-bit planar NAND, and even better performance in heavy workloads. V-NAND also shows a sustained P/E cycle for longer periods of time.
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